Heat dissipation (thermal management) Liquid 'DP Series'
By controlling the molecular structure, it becomes less likely to drip and evaporate! It exhibits a long-term stable heat dissipation effect.
The "DP Series" is a liquid-type thermal interface material (grease, paste, two-component curing) that can be filled or applied to heating elements, effectively filling small gaps with cooling components such as heat sinks. By controlling the molecular structure, it is designed to be less prone to dripping and evaporation, thereby providing stable thermal dissipation effects over the long term. The two-component curing type cures after mixing, offering high reliability and excellent pump-out resistance characteristics. 【Features】 ■ It allows for thin film application, achieving very low thermal resistance by uniformly filling gaps, resulting in excellent heat dissipation performance. ■ The use of filling equipment enables the automation of the application process through dispenser coating, making it easy to handle. ■ It retains flexibility even after curing, reducing stress on components. *For more details, please refer to the related links or feel free to contact us.
- Company：タイカ
- Price：Other
